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Hewlett-Packard, HP Pro 290 G9 Tower i5-13500 16GB DDR4 3200 SSD256 Intel UHD Graphics DVD W11Pro 3Y OnSite
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Hewlett-Packard Company or HP is an American multinational information technology corporation headquartered in Palo Alto, California, United States. It provides products, technologies, software, solutions and services to consumers, small- and medium-sized businesses (SMBs) and large enterprises, including customers in the government, health and education sectors.
The company was founded in a one-car garage in Palo Alto by William "Bill" Redington Hewlett and Dave Packard. HP is the world's leading PC manufacturer and has been since 2007, fending off a challenge by Chinese manufacture Lenovo, according to Gartner. It specializes in developing and manufacturing computing, data storage, and networking hardware, designing software and delivering services. Major product lines include personal computing devices, enterprise, and industry standard servers, related storage devices, networking products, software and a diverse range of printers, and other imaging products. HP markets its products to households, small- to medium-sized businesses and enterprises directly as well as via online distribution, consumer-electronics and office-supply retailers, software partners and major technology vendors. HP also has strong services and consulting business around its products and partner products. It is the world's largest PC vendor by 2012 unit sales.
Major company events have included the spin-off of part of its business as Agilent Technologies in 1999, its merger with Compaq in 2002, the sponsor of Mission: Space in 2003, and the acquisition of EDS in 2008, which led to combined revenues of $118.4 billion in 2008 and a Fortune 500 ranking of 9 in 2009. In November 2009, HP announced the acquisition of 3Com, with the deal closing on April 12, 2010. On April 28, 2010, HP announced the buyout of Palm for $1.2 billion. On September 2, 2010, HP won its bidding war for 3PAR with a $33 a share offer ($2.07 billion), which Dell declined to match.
Hewlett-Packard is not affiliated with Packard Motor Car Corporation, founded by James Ward Packard and William Doud Packard, or with Packard Bell.
| Grupa | Parametrs | Vērtība |
|---|---|---|
| Procesors | ||
| Maksimālā turbo jauda | 154 W | |
| Efektīva kodola bāzes frekvence | 1,8 GHz | |
| Procesora kešatmiņas veids | L3 | |
| Procesora kodoli | 14 | |
| Efektīvi serdeņi | 8 | |
| Procesora bāzes jauda | 65 W | |
| Procesora modelis | i5-13500 | |
| Procesora pastiprināšanas frekvence | 4,8 GHz | |
| Procesora paaudze | 13. paaudzes Intel® Core™ i5 | |
| Efektīva kodola maksimālā turbo frekvence | 3,5 GHz | |
| Procesora kešatmiņa | 24 MB | |
| Procesora pavedieni | 20 | |
| Veiktspējas galvenā maksimālā turbo frekvence | 4,8 GHz | |
| Veiktspējas serdeņi | 6 | |
| Procesora ražotājs | Intel | |
| Procesora saime | Intel® Core™ i5 | |
| Veiktspējas pamata frekvence | 2,5 GHz | |
| Grafika | ||
| Iebūvētās grafiskās kartes modelis | Intel UHD Graphics 770 | |
| Iebūvēto grafisko karšu saime | Intel® UHD grafika | |
| Diskrētā grafiskā karte | Nē | |
| Iebūvēta grafiskā karte | Jā | |
| Iebūvētais GPU ražotājs | Intel | |
| Diskrēts grafiskās kartes modelis | Nav pieejams | |
| Atmiņa | ||
| Atmiņas pulksteņa ātrums | 3200 MHz | |
| Iekšējās atmiņas veids | DDR4-SDRAM | |
| Atmiņas sloti | 2x DIMM | |
| Iekšējā atmiņa | 16 GB | |
| Atmiņas izkārtojums (slotu skaits x izmērs) | 1x16 GB | |
| Maksimālā iekšējā atmiņa | 64 GB | |
| Dizains | ||
| Kabeļa slēdzenes slots | Jā | |
| Ievada gads | 2023. gads | |
| 3,5 collu nodalījumu skaits | 2 | |
| Šasijas tips | Tornis | |
| Produkta krāsa | Melns | |
| Jauda | ||
| Enerģijas padeve | 180 W | |
| Ekspluatācijas nosacījumi | ||
| Darba temperatūra (TT) | 0 - 40 °C | |
| Darba relatīvais mitrums (HH) | 10-90% | |
| Svars un izmēri | ||
| Platums | 155 mm | |
| Iepakojuma dziļums | 400 mm | |
| Dziļums | 303 mm | |
| Iepakojuma svars | 8 kg | |
| Augstums | 337 mm | |
| Iepakojuma augstums | 499 mm | |
| Svars | 4,7 kg | |
| Iepakojuma platums | 287 mm | |
| Tīkls | ||
| WLAN kontrollera ražotājs | Realtek | |
| Augstākais Wi-Fi standarts | Wi-Fi 6 (802.11ax) | |
| Bluetooth versija | 5.2 | |
| Ethernet LAN | Jā | |
| WLAN kontrollera modelis | Realtek RTL8852BE | |
| Bezvadu internets | Jā | |
| Wi-Fi standarti | Wi-Fi 6 (802.11ax) | |
| Bluetooth | Jā | |
| Antenas tips | 2x2 | |
| Performance | ||
| Paroles aizsardzība | Jā | |
| Paroles aizsardzības veids | Ieslēdziet barošanu BIOS Lietotājs | |
| Uzticamās platformas moduļa (TPM) versija | 2.0 | |
| Produkta veids | PC | |
| Tirgus pozicionēšana | Pierādīta produktivitāte | |
| Mātesplates mikroshēmojums | Intel H670 | |
| Audio mikroshēma | Realtek ALC3867 | |
| Uzticamas platformas modulis (TPM) | Jā | |
| Iepakojuma saturs | ||
| Komplektā tastatūra | Jā | |
| Tastatūras savienojamība | Vadu | |
| Komplektā pele | Jā | |
| Paplašināšanas sloti | ||
| PCI Express x16 (Gen 4.x) sloti | 1 | |
| PCI Express x1 (Gen 3.x) sloti | 1 | |
| Programmatūra | ||
| Uzstādīta operētājsistēma | Windows 11 Pro | |
| Iepriekš instalēta programmatūra | HP datoru aparatūras diagnostika UEFI; HP atbalsta palīgs; HP datoru aparatūras diagnostika Windows; HP Image Assistant; HP pārvaldāmības integrācijas komplekts; Veiktspējas padomnieks 3.0 | |
| Uzglabāšana | ||
| Uzstādīto SSD disku skaits | 1 | |
| SSD interfeiss | PCI Express | |
| SSD formas faktors | M.2 | |
| SSD ietilpība | 256 GB | |
| Uzglabāšanas datu nesējs | SSD | |
| Kopējā SSD ietilpība | 256 GB | |
| Optiskā diskdziņa veids | DVD±RW | |
| NVMe | Jā | |
| Kopējā uzglabāšanas jauda | 256 GB | |
| Instalēto atmiņas disku skaits | 1 | |
| Porti un saskarnes | ||
| Līnija | Jā | |
| USB 3.2 Gen 1 (3.1 Gen 1) A tipa portu skaits | 4 | |
| HDMI portu daudzums | 1 | |
| Ethernet LAN (RJ-45) porti | 1 | |
| Line-out | Jā | |
| Kombinētais austiņu/mikrofona ports | Jā | |
| VGA (D-Sub) portu daudzums | 1 | |
| USB 2.0 portu daudzums | 4 | |
| Zīmola īpatnības | ||
| HP GTIN (EAN/UPC) | 829160697413 | |
| HP drošības rīki | Piekaramās atslēgas cilpa; Uzticamās platformas modulis (TPM) 2.0; Integrēta piederumu kabeļa slēdzene; Plāna kabeļa slēdzene | |
| ZS segments | Bizness | |
| HP atbalsta palīgs | Jā | |
| HP JumpStart | Jā | |
| Ilgtspējība | ||
| Ilgtspējības atbilstība | Jā | |
| Ilgtspējības sertifikāti | ENERGY STAR | |
- 2x2
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